Please ensure Javascript is enabled for purposes of website accessibility

Issue Brief: Connecticut's Bonding Process (Office of Legislative Research)

Dec 7, 2018

This issue brief from the Connecticut General Assembly's nonpartisan Office of Legislative Research describes Connecticut's bonding program and the process for issuing bonds.

Citation

Gadson, C. (2018). Issue Brief: Connecticut's Bonding Process (2018-R-0279). Hartford, CT: Connecticut General Assembly, Office of Legislative Research. Retrieved from https://www.cga.ct.gov/2018/rpt/pdf/2018-R-0279.pdf.

Back

Stay Up-to-Date

Sign up to get new reports and the latest data sent right to your inbox.

We care about the protection of your data. Read our Privacy Policy.